Sorry, it's not quite on topic, and im dubious if my facts are correct, but isn't the CIC chip just a random number generator (with a fixed seed) that compares itself to another identical chip to check output values?
I'm not sure what is in it, but some patents referred to a 4-bit processor. So I was hoping the pseudo-random number generator was done in software (and that we could recognize the processor from the code ... and some time of patient individuals).
Actually, my memory isn't that good. I'd have to recheck the patents to make sure, but the above is what comes to mind.
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Off topic, but, can anyone tell me what happenned with the "SF7 BIOS ReWrite" that some people here started on (or at least were talking about starting)?
Can the ROM be in use when you're looking at it? Wouldn't electrons flow to a specific bit if you tried reading that bit? Wish I could help you more, some time ago I found a very technical site with a schematic diagram of EPROM but I'm having a very hard time finding it.
In particular, I'm still curious about the SNES CIC chip, as well as the DSP roms.
Well, that answers my question about whether or not we have the DSP ROM extracted. Too bad, as you can still by the chip from a few places.
As for whether or not you can do it: um, in theory, of course. But practically? http://www.eet.com/design_library/cd/np/showArticle.jhtml?articleId=16501843&kc=6418 has the basic process for how you'd examine an antifuse-based system. A flash-based system is essentially impossible for a purely visible inspection.
Note that even without extracting the ROM, it may be able to yield some useful information in the case of the CIC chip - but I think most of that info is documented in the patent (or is that the NES one?)
Also, I'm not sure the best way to remove the plastic around the chip (is it possible to do "gently" enough to know which lead connects to which pad on the chip)?
Are the DSP/CIC chips plastic or ceramic? I'm at work, so I can't remember right now, but unfortunately I think the CIC chip at least is plastic.
If it's a plastic package, it's not easy. You basically need to bake the chip and then rip the package apart, or else use really nasty chemicals. Companies exist for the sole purpose of doing this, so if anyone's ever done it as a hobbyist, I'd be amazed (and, uh, scared).
Ceramic packages, however, are far easier. I've actually managed to pop a few by just putting them in a vise and twisting them apart (DIPs only, of course). If you only apply just enough force to pop the seal, you should still be able to see where the leads go.
I've also managed to pop a few QFP packages by shorting various pins and having the package explode, but I don't think that's what you're looking for. 
Curiously, the first link I just found on Google regarding decapping is actually pretty informative. http://www.semiconfareast.com/decap.htm
No, it doesn't really work like that. For a rough idea, you can consider the SEM like a microscope that uses a focussed electron beam shining on a surface, instead of focussing light coming off a sample like an optical microscope.
The schematics would have to be quite low level for them to be helpful, and even then I'd have to guess how they turned that into layers on the chip. The best would be something that explains the layer by layer processing creating a standard ROM cell (ie one bit in the ROM array). This is probably in decent "IC design" textbooks, but I don't own any.
EDIT: Wow, thanks for the info barawn. I'll check that out...
The page you gave is interesting, but ROM isn't really any of the three memory types discussed that. (Although if anything, it would resemble the "anti-fuse" type the most.) Sadly, they mentioned that a cross section or delayering is necessary ... so the same is most likely true with ROM. I was afraid of that. Oh well.
I probably practice "openning" a few cheaper chips first, and see what is to be expected. If it looks possible, I'll give it a go on the real thing.
The page you gave is interesting, but ROM isn't really any of the three memory types discussed that. (Although if anything, it would resemble the "anti-fuse" type the most.) Sadly, they mentioned that a cross section or delayering is necessary ... so the same is most likely true with ROM. I was afraid of that. Oh well.
Nope, I was wrong.
There's a pretty classic paper on extracting data from supposedly "secure" systems from USENIX a while back - http://www.usenix.org/publications/library/proceedings/smartcard99/full_papers/kommerling/kommerling_html/ is the paper. ROM's quite possible.
The main problem, of course, is that most of the methods for extracting the data are chemical, rather than optical tricks, as the data is usually sublayered.
Don't suppose you can convince the lab to experiment with random chemical etching? 
That paper is great!
There is an FIB in the lab, but that seems unnecessary, and I also don't really have much of a need/reason to get training on it.
Figures 5 and 6, showing the ROM, are awesome. I don't really understand the processing figure 6 (NAND ROM) is referring to, so I probably couldn't acheive that. However, figure 5 (NOR ROM) ... I can easily do an HF etch. So that is quite doable!
I still need to figure out a method to get through the plastic shell though. The fuming nitric acid method isn't really something I can do here. I think I'll break open some cheap chips so I can get an idea of what I'm working with (I don't even know how much "room" there is around the silicon piece).
Plastic melts a quite a different temperature than silicon/gold correct?
Would not a really hot oven melt away the offending plastic casing?
(althought that may still leave a layer of muck on top of the chip.)
Not everything melts. I have a feeling this plastic falls in that catagory. I'd expect it to just burn and leave nasty junk behind. Even if it did melt, you're probably correct about it leaving a layer attached to the surface.
I still haven't tried breaking open some cheap chips ... I'll do that tonight hopefully.
I was curious so I gave it a try and totally murdered a dsp-1 chip. The CPU is glued to a metal square about 1cm in width and is embedded into the cap of the chip. It's more or less just a thin layer of glass which breaks easily.
I remember seeing an episode of Ripley's believe or not a couple of weeks ago about a guy who has a hobby finding graffiti on Computer chips. Maybe he might be able to give us some insight into how he does it. I found his site on the internet and it seems he also does custom shots as well.
http://microscope.fsu.edu/micro/custom.html
http://microscope.fsu.edu/micro/contact.html
I've wanted to experiment with decapping some DSP chips and taking some photos to see if there was a chance to read the ROM contents but I never got around to it.
The ROM should be recognizable as you mention. It's array may or may not be regular, which could pose a challenge for optical readout. I would suspect that on the process used for the DSP1 (hopefully only a couple of metal layers) that you might be able to read out the bits optically so long as they don't use some form of memory array compression which is common today. On an EPROM device you can't compress the array because it must be able to hold random data. On a ROM based device you can sometimes compress the array. A simple form of compression would collapse duplicate memory rows to one and expand it with address decoding.
We know what is the in the DSP1 data ROM. I'd start looking for that data first. If you can't find that then you're probably out of luck.
You can use fuming nitric acid to decap plastic chips but I hear the stuff is really nasty and you don't want to be breathing the fumes so I'd be very careful if you attempt this yourself. I'd look into having somebody do it.
You might check out some of these sites for some good information:
http://www.cl.cam.ac.uk/users/rja14/tamper.html
http://www.cl.cam.ac.uk/~sps32/
http://www.cl.cam.ac.uk/~sps32/mcu_lock.html
We can already read the data ROM out of a DSP1. If we could just find the mux that controls selecting the source data maybe we could force it to always return the program ROM instead.
Well, here's some update info:
I used a file to go through some cheap logic chips to familiarize myself with the inside of a chip. One thing I never noticed before: look closely at the end of IC dip packages. There are two small copper dots on both ends. These are actually ends of leads that conenct to a copper backing on the silicon chip. I'm not sure what this is for, but one of my friends guessed it was just for cooling purposes. Sounds plausible.
The top of the silicon seems to have glass or something over it. No matter how careful I was (which isn't much considering I was using a file), I never succeeded in removing the silicon piece intact.
It turns out that one of my friends works in a lab that uses nitric acid (for cleaing samples) quite reqularly. It is 70% (by weight I assume?) so not the 98% all those articles you guys found. Also, the one article mentioned that it was very important that everything be done in a dry environment or the water would corrode metal contacts and the nitric acid would desolve it. I don't even understand what they are suggesting ... the acid is in water so what do they want people to do?
I took a D411 security chip and put it in a vial of the acid and set it outside. The pins started reacting a bit and the fluid turned a bit greenish. Hours later, I checked and not much changed (I could still read the label on the DIP chip even). I was hoping the heating here was only to speed up the reaction, but wasn't necessary. Apparently this isn't so. We put the vial in a pot of boiling water and it immediately turned red and started dissolving everything. I'm glad we did this outside, as it looked quite nasty and even from a distance the smell was noticable.
The pins and alluminum leads (I assume that's what that metal is) looked quite dissolved and destroyed. The actual chip and gold wires looked fine, but were covered in some junk still. Under a simple optical microscope, I could see the 'traces' on the chip and tons of "salt/junk" everywhere. I cleaned with acetone and water. Now I can see the chip surface decently.
I'm not sure what I'm looking at. I think it is the metal interconnect layer. There are some large arrays (like interlocking combs) but very very little of anything that looks "randomish" like a CPU core or anything. Basically the chip looks much much simpler than I expected. I'm not sure what to do now.
I'll try to find a place with an optical microscope with a camera so someone more knowledgeable can comment and hopefully teach me what the heck to look for. BTW, the features of the chip are much larger than I expected. With x100 magnification I can already see pretty much everything. At x400 I can see the traces much better and they have a regular rectangular pattern/impression in them. Not sure what that is for.
Even without a picture, can anyone comment/confirm what I am looking at?
If it is the metal interconnect layer, can I really remove the supporting structure with HF? If so, I'll try that next (I definitely want to take a picture of this layer before removing more though).
Wow this is fun!
I found a really nice optical microscope that I can use. It's in one of the clean rooms here so it is meant for looking at this kind of thing ... and let me tell you, it makes the images look SO much nicer (something to do with the lighting, I'm not sure what it is... also, I think there is a polarizer on the lighting. What exactly is that for? To let me see the layers better?) Plus having a translating mount for the specimem is really useful.
Sorry for the babbling.
Anyway, I wanted to add the following notes:
In 'big' lettering, the corner of the chip has "S268".
In 'small' lettering, in a collumn on the side: "00A", "35A", "50A" (and each is colored slightly different ... again, I don't know squat about this microscope. What does the color difference mean?).
In 'small' lettering right in the middle of the only complicated looking part of the chip it says "60A".
Any ideas what the lettering means?
Also, besides the light source and polarizer, nothing looks special about this microscope ... so if someone knows for sure what the different coloring corresponds to, I'd be grateful to find out.
The microscope has a camera mount, but I don't have a camera. So I'll need to borrow a digital camera from a friend before I can take pictures.
Sorry for all the questions. I feel quite stupid and clumsy right now, because I know very little about this stuff. So please be patient with me while I soak all this in.
Go there:
http://micro.magnet.fsu.edu/primer/index.html
It has gobs of microscopy info, and photo galleries as well.
Also, good job neviksti!

Fascinating.
I'm looking forward to some pics of that. Maybe it'll give me some insight into the NES lockout chip too. Seems like it wouldn't be much different (maybe).
BTW, I think chip pins are normally tin-plated copper. I wish I had some actually helpful info, heheh.
The human eye is amazing. That being said, digital cameras suck compared to it and here are some pictures:
MAD-1 (11.1 MB) - SNES memory address decoder from a cartridge
SN74AHCT08N (26.6 MB) - Quad AND gate
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Comments:
74AHCT08 - This was to help me see what some "standard" input/output stages for pins are. Also, to see if I have any hope of being able to understand the logic from the picture (turns out, probably not ... or at least not without much more info about the 'hidden' layers).
It is easy to see the four repeated sections that must correspond to the AND. But for completeness of this 'test case', the whole chip is shown with a series of zoomed in pictures. So feel free to check that out and see if you can understand the logic.
MAD-1 - sorry about the junk still on the chip. Not everything dissolved away. I'll have to try cleaning it again.
That being said, the MAD-1 is fairly bare.
Any idea what the large 'array' is? There are a couple of zoomed in pictures of it for you.
There is only one part that seems full of logic. I zoomed on this and referred to it as the 'complex'. Also, 4 lines coming from the top of the complex continue around the array ... but don't seem to connect to it (from what I can see).
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Besides vague questions above, I could use help with the following from someone knowledgeable:
Did I preserve the top layer of the circuit (metal interconnect + oxide?), or did that get taken away?
I am worried because the nitric acid completely destroyed the DIP leads.
Also, for anyone with the capability of reading these, I can take closer pictures (or much much easier, look with my eye for something specific). I wish everyone could see it in the microscope; it is so much clearer.
Wish I could see inside too, very interesting! Never seen a gate before. I'm sure learning about microscopy could help a lot in resetting security fuses
Any idea how people do that? It's not like you can use tweezers hah
Edit: hmmm, so just any 400x microscope can see that well?
Edit: hmmm, so just any 400x microscope can see that well?
I was originally going to use the chips as a fun way to train myself on the SEM. But I haven't been able to get time on it yet. So, I've been just looking at stuff with optical microscopes (which is all you really need for this kind of stuff).
So the answer is: yes ... well sort of. The first microscope I looked at it with was just an ordinary cheap microscope. The difficult part was correctly illuminating the surface, and also moving the chip around when looking at higher magnification.
The microscope I used to take those pictures had a nice translating stage and illuminated the sample through the collumn/lense itself (as well as having a polarizer for the light ... but I still don't fully understand, or know, if that really helps much). The nice illumination makes all the difference. I couldn't see nearly as much detail with the first microscope.
Is there a place where people can buy small quantities of nitric and HF acid? If so, then maybe several of us can look into this "manual ROM reading" stuff.
Ahh! I made a really stupid mistake.
I grabbed a chip from a small pile of SNES chips that I was studying long ago and for some reason had it in my mind that it was a D411. I even wrote the chip information down as a MAD-1 (and all the date code stuff) before I dissolved the chip package ... for some reason it didn't register until I saw the slip of paper again this morning and was quite confused. I definitely need more sleep.
So, sorry about that. (I editted the 'picture post' above accordingly.) At least we know why the chip was so bare now. Do you think that big array is just an on chip resistor for dealing with the SRAM?
I'll check out a D411 for real later this week. I can't wait for the weekend when I can get a nice long night of sleep (had to pull an all-nighter again this night/morning).
Update:
Well, I got impatient and decided to go straight to the DSP1(b).
Here's an overview picture of what the whole chip looks like: overview
I believe the two dark bars in the upper left are the data ROM, and the two larger dark bars in the upper middle are the program ROM.
I'm not sure what the large two dark bars in the lower left are. The individual cells look way too simple for SRAM. Maybe it's the multiplier (just a huge array of shift+add?). Here's a picture: ??Multiplier??
The large array in the bottom center looks to me like it might be SRAM. But maybe this is actually the multiplier. Picture: ??SRAM?? You can see 4 of the "cells" that are repeated constantly in this array (the other stuff right through the center is just part of a bus and connections to it I think). The "cell" here looks complicated enough that I might believe there are the 6 or so transistors needed for a flipflop in there.
Anyway...
Here's a zoom in on some of the ROM:
ROM before etch
I had trouble etching the layers nicely away with HF. I let it soak for about 15min and there was still a lot of metal lines left. So I had it sonicating in the acid for 45 more minutes and there is still a lot of stuff. Maybe it just takes a really long time?
Here's some of the ROM with the upper layers still hanging around:
ROM not fully etched
Here's a region where the upper layers went away quite nicely.
ROM with top layers gone
You can view all other miscellaneous pictures if you want: picture directory
As you can see, I can not read the data out from this. Maybe it is one of those "ion selective" type ROMs that was mentioned earlier in those papers you guys found. They refer to "ion selective 'staining'" so that the ROM data may be seen visually. How in the world do I do that?
If I ever get time on the SEM, it is possible that the differently doped material will scatter electrons differently enough that I could see the ROM data there ... but I don't really know what to expect from the SEM.
Any ideas of where to go now?
As you can see, I can not read the data out from this. Maybe it is one of those "ion selective" type ROMs that was mentioned earlier in those papers you guys found. They refer to "ion selective 'staining'" so that the ROM data may be seen visually. How in the world do I do that?
Can you get access to the book referenced in the USENIX paper? ("Integrated circuit failure analysis", by Beck). That looks almost exactly like NAND ROM that's on there.
I checked and it's not at any of the libraries around here ... and the book is too expensive to get just for one passage. There has to be something on the internet, but I must be searching for the wrong keywords because I haven't found much of anything yet.
Here's a region where the upper layers went away quite nicely.
ROM with top layers goneYou can view all other miscellaneous pictures if you want: picture directory
As you can see, I can not read the data out from this. Maybe it is one of those "ion selective" type ROMs that was mentioned earlier in those papers you guys found. They refer to "ion selective 'staining'" so that the ROM data may be seen visually. How in the world do I do that?
In the above photo, isn't it apparent which bits are set and which are clear? Unless my eyes are playing tricks on me some cells appear transparent while others are not. Something like 0x0f, 0x01, 0x00, 0x01, 0xc1, 0x00, 0xe0, 0x00, etc
Luminating from behind might help distinguish the cells a bit better?
I think you're right about the two ROM locations. The size difference is about what I would expect between the two. The program ROM looks to be twice as high (1024 vs 2048) and 50% wider (16 bits vs 24 bits). I think the lower left array might be the RAM though, it's too regular, too much like a memory array to be anything else. I'm guessing it takes up more area because the RAM cells use many more transistors than the ROM cells.
It could be tricky to extract the program ROM data if the ROM uses implants which can't be visually detected. Mod the PC to ignore loads so it increments sequentially and read each of the 24 data bits out one by one with a well placed probe? I'm not seeing much of an option. I thought about attempting to hijack the execution with code inserted into RAM (or somewhere else) but that won't work because it looks like the PC only pulls from the program ROM, and how would you insert it into RAM anyway?
It was once suggested to me that it was very likely that NEC had a backdoor mechanism to test chips with that could be used to recover the rom data. This would make sense because otherwise how could they verify the chips were good? Even if there were such a mechanism, what would the effort involved in deciphering it be? I don't know.
It's cool to see pics of the chip.
In the above photo, isn't it apparent which bits are set and which are clear? Unless my eyes are playing tricks on me some cells appear transparent while others are not.
It doesn't come out well in the photo, but the "ROM dots" look like a full rainbow of colors depending on how the light hits them. Also the color seems to depend a bit on how well the layer above was "etched". So I have a feeling that the color difference is just do to a thin oxide (glass) causing a "rainbow oil film" affect.
I may be wrong, but I feel fairly confident saying that I don't think there is any real visual indication of the data here. (The color changed significantly between the two etching attempts.)
Luminating from behind might help distinguish the cells a bit better?
I'm probably misunderstanding you here, as I don't really know what you are suggesting. Silicon is not transparent to the visible spectrum, so I can't just shine a light behind it.
It could be tricky to extract the program ROM data if the ROM uses implants which can't be visually detected. Mod the PC to ignore loads so it increments sequentially and read each of the 24 data bits out one by one with a well placed probe? I'm not seeing much of an option.
In an earlier post you mentioned changing the circuit as well.
I haven't even been able to extract the chip with the leads still attached. Also, I don't even know how I'd attach a probe to something so small. As far as I know, the labs here have no "probing stations" (like mentioned in those articles you guys found).
Changing the circuitry is even more beyond me. I still can't even identify the data bus on the chip (quite frustrating actually). There is an FIB here, so technically if I learn more it is possible, but I have no reason to get training on the machine ... I guess I could pull favors, but I don't even know what to do with such a thing.
It was once suggested to me that it was very likely that NEC had a backdoor mechanism to test chips with that could be used to recover the rom data. This would make sense because otherwise how could they verify the chips were good? Even if there were such a mechanism, what would the effort involved in deciphering it be? I don't know.
Hmm... I proably should have taken pictures of it before etching, but I did see what looked like "testing pads" on the edge of the chip (some even had labels). However I didn't analyze it to closely, as I didn't think I'd be able to attach anything to it.
You probably know much much more about this stuff than I do. Do you have access to any equipment that would allow you to play with the chip?
Also, if you feel comfortable with this, would you mind asking around at work to see if anyone knows how to do the "ion-selective staining" that was used to photograph that NAND ROM diffusion layer?
It looks like I'll get some time on the SEM tomorrow. I'm still hoping that might allow distinction between the ion implantation. We'll see..
In an earlier post you mentioned changing the circuit as well.
I haven't even been able to extract the chip with the leads still attached. Also, I don't even know how I'd attach a probe to something so small. As far as I know, the labs here have no "probing stations" (like mentioned in those articles you guys found).
I might be able to help with getting a chip decapped that's still usable. Without a probing station our options are more limited.
Changing the circuitry is even more beyond me. I still can't even identify the data bus on the chip (quite frustrating actually).
I have similar trouble. I do know a couple of people who are in a position to know this. I could ask a few specific questions but it's unlikely I'll be able to get them to devote a large amount of time to study it.
If you look at the ROMs (and RAM) you should see at the ends of the blocks a much smaller block of circuitry. This is the decoding logic for the ROMs and probably also the bus interface. If you look on the other side of it I think you'll find the data and address busses.
There is an FIB here, so technically if I learn more it is possible, but I have no reason to get training on the machine ... I guess I could pull favors, but I don't even know what to do with such a thing.
You're better off than me. If I want a FIB it's likely I'll have to hire it out. A FIB (Focused Ion Beam) deposits a conductive material across the die from one point to another which has the effect of adding a wire to the chip, making a connection where there wasn't one before which sometimes can be quite helpful. When chip companies make new chips they typically put some spare gates on the chip (if they have room) so that if there is a small problem they can connect up some of the spare gates, usually first with a FIB, then with a metal change, to see if they can correct the problem. A FIB is similar to routing a new trace across a PCB. If you can find a path that doesn't cross existing traces you can do it.
You probably know much much more about this stuff than I do. Do you have access to any equipment that would allow you to play with the chip?
Unfortunately no. We do have a lot of the equipment but I don't have access to it and I don't know the people who work there. I might be able to get a couple of chips decapped, or maybe not.
Also, if you feel comfortable with this, would you mind asking around at work to see if anyone knows how to do the "ion-selective staining" that was used to photograph that NAND ROM diffusion layer?It looks like I'll get some time on the SEM tomorrow. I'm still hoping that might allow distinction between the ion implantation. We'll see..
Selective staining? Is that to see the implants? The people that probably know, I don't know. I do know one guy who might know. I'll check with him.
Some info, I though everyone might like to know. May or may not be useful now...
Here's a nice doc that explains NAND and NOR ROM.
http://www.csse.monash.edu.au/courseware/cse3142/Lnts/C08.pdf
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Well, I got time on the SEM today. It took me awhile just to get some decent images to show up. Then I played with some settings (mainly just the beam voltage) trying to enhance the distinction of the rom bits. The distinction looks much better than in the optical microscope, but to be honest, I'm still not sure if I'm really measuring what we're hoping for.
The image is the # of secondary electrons measured when the beam is focused on that point (the beam is rastered across the sample). The brighter a region, the more electrons that were measured at that point. To be fair, there are still some backscattered electrons being picked up as well (from my understanding, secondary electrons are ones that are ejected from the sample where as backscattered electrons refers to beam electrons that scattered off the surface... thus the secondary electrons have much less energy). My hope was that at low enough beam voltage, there would be an appreciable difference in the number of ejected electrons from an N doped region as opposed to a P doped region. Which would effectively allow us to read the bits directly from the image.
Pictures:
Overview
Close up of me working my way through the entire left DataROM array -
img1
img2
img3
img4
img5
img6
img7
img8
Here's what's left of the circuitry at the bottom of the array -
img1
img2
img3
img4
You can check out some other pics here:
(In particular, what the contrast/image quality is at different voltages.)
picture directory
My current impressions:
The two DataROM arrays are the upper and lower 8 bits (not sure which is which yet).
The large 'transistors' at the top of the array are the pull up transistors.
The address decoder is the circuitry at the bottom of the array.
So the data is "vertical" is the pictures.
I haven't taken time to actually try to match up the data with the pictures yet. I'll probably give it a try after dinner.
Let me know if anyone figures out how the data is alligned in there. (In case you don't know, the DataROM is already know and can be seen here.)
EDIT: Please note that unlike a top illuminated optical miscroscope, the junk on the surface will actually cast shadows in a particular direction in SEM images. So the bits "behind" junk may appear artificially dark.
EDIT(2):
The array -
collumns: 64 (8, 8,8 8,8 8,8 
rows: 128+8 (16,16,16,16,16,16,16,16,
The extra 8 rows must be additional parts of the address decoder.
I don't see any pattern here ... so we probably failed in retrieving the data we wanted. 
Wow this is exciting! It's hard to tear myself away from these pictures.
I'd say almost certainly you are right, this is the data ROM. It forms a different pattern in my mind though. We can see it is divided into two halves but I suspect these are the lower and upper halves of the address range of the ROM. I look at the left half and I see from top to bottom 8 blocks of 16 bits plus 8 extra bits. I think the data bus goes left to right. This would mean the transistors on the bottom are row enables. There should be some column enables in the transistors to the right. So, in each half we have 16 bytes (8 words) top to bottom (plus 8 extra bits we'll pick up in a minute), going across we have an array of 8 blocks of 8 = 64. 64 times the 16 bytes is 1024 bytes (512x16bits) which is 1/2 the size of the data ROM.
What are the 8 extra bits at the bottom of each line of 8 words (8x16bits)? If this were the program ROM I'd say they were the protection bits. One bit to enable protection for each 16-bit word. The data ROM is not advertised as having protection bits. Maybe it does or maybe they aren't used or maybe the factory used this as a checksum for the line of data above it?
If they were protection bits this brings up some interesting questions:
Are they using EPROM cells here or mask rom cells? If it's EPROM cells we can clear them with UV light , but based on my experience this chip doesn't have the readout mechanism enabled. Is the readout circuitry gone or just disabled on the chip somehow? If it's still there and we can enable it then we have a method to extract the ROM contents.
"Manually" extracting a ROM
I recently got some initial training to use, and now have access to, an SEM (scanning electron microscope). I am curious as to whether anyone here has enough low level electronics knowledge to know if it is possible to "manually read" a ROM by looking at the top layer of the silicon chip. It will take awhile for me to get comfortable using the machine, and I thought it would be fun to learn by looking at some circuits.
In particular, I'm still curious about the SNES CIC chip, as well as the DSP roms.
I don't have the means to remove layers, so I can't do a deep / layer by layer analysis (there may be a way to sputter layers off the surface, but I haven't looked into this yet ... but I defintely won't be able to precisely grind away layers). So it is important that the ROM be readible by looking at the top layer only.
I know the basics of how these circuits are built (some engineering friends of mine took a class in designing IC's), but I don't know what the standard ROM cell looks like. Know where I could look it up?
Actually I'm not even sure how to recognize the rom on the chip. Unless a better suggestion comes along, I'll just look for a large repeating array and hope that's it. Also, I'm not sure the best way to remove the plastic around the chip (is it possible to do "gently" enough to know which lead connects to which pad on the chip)?
Sorry for all the questions,
-neviksti...
P.S. Yeah, I've been gone for quite awhile. School is just too busy for me to work much on my SNES projects anymore ... so it's best to just consider any that I haven't finished as "on hold for an indefinite amount of time". Sorry.